So today I soldered my first surface mount component - a PIC32 100 pin
TQFP package with 0.4 mm pin pitch. It was perfect.

I would post pictures, but unfortunately, my camera is damaged.

I did it with a simple radio shack soldering iron, liquid flux, copper
desoldering braid and a TQFP adapter board.

I first put liquid flux on the adapter board's pads with the flux
applicator pen. Then I placed and aligned the surface mount component
on the pad. This was the most difficult part.

I then put some tape on it so it wouldn't move around and soldered a
few pins to hold it down. Then on the opposite side I used the drag
solder & flood method (albeit easy on the solder) and continued the
rest of the way - all around the chip. Some pins were bridged - so I
took some handy copper desoldering braid (this stuff is awesome) and
dragged it across all the pins with the hot iron. The excess solder
was effortlessness absorbed and I was left with a cleanly soldered 100
pin 0.4 mm pitch TQFP component!

Some of you may believe that I tend to ask too many questions
regarding seemingly simple topics such as PCB etching or surface mount
soldering - but it helps - because I got it perfectly the first time -
no mess ups.

Interestingly enough, when I did my motorcycle insurance course, the
instructor assured me (and was willing to bet) that I would drop the
motorcycle since I had not driven one before (but had studied it
carefully beforehand). Needless to say - I didn't drop it at all - or
lose control. I didn't take the bet though :(

I just hope this trend follows through till next week when I etch my
first PCB :)

Next up: etching a PCB for the PIC32 on a single sided copper clad board.
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