On Mon, May 25, 2009 at 9:32 PM, Chris McSweeny wrote: > Does anybody have info on the weight of different packages? Mainly > interested in DIP8 and SOIC8, though info on other packages would be > interesting. Have a very weight critical application, hence also considering > going PCBless and soldering connections straight to device pins (are any > other 8 pin packages feasible to hand solder to?) Just in case anybody is interested, I ended up ordering 10 of each (AVRs, not PICs - 4 times higher effective clock speed/instruction rate/timer resolution in an 8 pin package wins yet again). DIPs weighed 6g for 10 (0.6g each), SOIC didn't even register a single gram, so <0.1g each. I wouldn't necessarily trust the accuracy of the scale that much, but convinced the DIP are at least 4 to 5 times heavier than the SOIC and 0.6g is a significant amount of weight in the context. -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist