Chris McSweeny wrote:
> Does anybody have info on the weight of different packages? Mainly
> interested in DIP8 and SOIC8, though info on other packages would be
> interesting. Have a very weight critical application, hence also considering
> going PCBless and soldering connections straight to device pins (are any
> other 8 pin packages feasible to hand solder to?)

It varies a bit.  DIP8s come in from 1.0 to 1.5 gms while SOIC8s are 
about half that.

So, blimp? kite? micro-uav? other?
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