On Thu, Mar 26, 2009 at 3:06 PM, solarwind wrote: > I recently read an article on the Sparkfun website regarding reflow > soldering for surface mount components that can be done at home on any > form of hot plate (stove top frying pan, skillet, etc...). > > I have several questions regarding this (that were unanswered in the > article, and for which I was unable to find answers on the Internet). > > * I thought heat damages components. I was consistently cautioned not > to overheat components during hand soldering. If the idea is to heat > up the solder just enough to melt (and maybe a bit more so as not to > form a "cold soldered" joint), then wouldn't reflow soldering do the > same damage to components? > > * One of my DIP chips came with a notice saying that it should be > "cooked" at 125 degrees Celsius prior to reflow soldering. I would > never reflow solder a DIP chip, but this is interesting. Why do they > have such requirements? Is it because of any possibility of trapped > moisture in the chip that could rapidly expand in high heat and damage > internals? What's the worst case for not obeying this notice? > > * I've also heard of reflow soldering "profiles". What exactly are > these profiles? Is it a requirement that I adhere to them for homebrew > reflow soldering projects? > > * How do I apply solder paste on pads? Do I just squeeze it out of the > tube and rub it consistently over the pads so that all of it is > connected? Does a very precise amount need to be applied discretely on > each individual pad? How is this done? > > * Where to buy solder paste, are there different types, what brand, > what type? Should I use flux? Should I pre-flux the pads or apply flux > and then solder paste? > > * I've also heard that it is wise to calibrate or know where your > skillet/stove reaches a certain temperature. What temperature is good > for reflow soldering? How do I measure this temperature? > > * How long should the PCB be on the skillet/frying pan during the > reflow soldering process? > > I know these are a lot of questions, but I am very interested in this > cost-effective do-it-yourself technique to solder surface mount and > fine pitch components on PCBs with ease. > Short answers cause I'm busy today: Solder paste: http://www.dealextreme.com/details.dx/sku.7952 Kapton stencil: http://ohararp.com/Stencils.html (you can buy better solder and better stencils, but these work). Toaster oven: http://www.goodwill.org Profile: bake on "broil" until the solder melts, then open the door until it freezes again. Overall: this method isn't worth the trouble and mess for single boards, and isn't economic for large quantities (>50 boards). For just a few boards, it works fine. It turns out that most components aren't super-sensitive to heat. Connectors, etc. made with plastic are the most susceptible. Solder paste is more dangerous than solder wire: it would be easy to get some on your hand (it's sticky) and then ingest it. Regards, Mark markrages@gmail -- Mark Rages, Engineer Midwest Telecine LLC markrages@midwesttelecine.com -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist