I found, solding paste and hot gun, is already very reliable and fast process. I replaced TSSOP chip many times. no problem at all. some tiny chip, lm74 CAN5 footprint, 2*2 SON footprint, I found is even more easier to do than long line of foot on 64 pins TQFP. They don't have "foot" only tiny pad! Believing is duo to getting heat easilier! ----- Original Message ----- From: "Jinx" To: "Microcontroller discussion list - Public." Sent: Saturday, December 06, 2008 8:59 PM Subject: Re: [EE] Make Your Own PCB > > Reflow? > > Meaning the components and track already have enough solder to make > a joint. For example IC leads are already coated with solder (tinned). If > the track is also coated with solder then all that's needed is to put the two > together, ie put the IC on its pad and apply heat. Tinned component leads > would probably not have enough solder to flow onto a bare copper track, > even using flux to reduce surface tension, so you need to feed solder in as > you heat. How much and whether you have to depends on the components > > -- > http://www.piclist.com PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist __________________________________________________ Do You Yahoo!? Tired of spam? Yahoo! Mail has the best spam protection around http://mail.yahoo.com -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist