An existing push button N/O push to operate switch uses through hole 
techology. Use rate is reasonably high - target is 100,000 reliable 
operations in 5 years. It's behind a rubber boot and forces on it are liable 
to be "reasonably vertical" most of the time. A user would have to try 
reasonably hard to exert any noticeable sideforce on the switch. It's in 
portable equipment which is liable to be in regular use every dau in many 
cases and also liable to be subject to a reasonable amount of rough and 
tumble The switch is not liable to usually be subject to extreme forces and 
it's not a high vibration environment. [[No prizes for guestimating the 
appliocation. Nor comment probably]].

SO

The manufacturer wants to change to a surface mount switch.
I'm a bit dubious about the probable longevity of the mounting if solder 
alone is used. Adhesive could be added as a backup.

Any thoughts?

Ant experiences to relate?

Vaguely related data points:

- Solder is subject to creep tatigue.

- Make a key ring from an old SIM RAM card with SMD RAM chips. Notice a few 
weeks/months on that all the ICs have invariably fallen off.



         Russell



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