On 6/10/08, Robert Young wrote: > > > > > Date: Tue, 10 Jun 2008 13:13:04 -0300 > > From: john@jcoppens.com > > To: piclist@mit.edu > > Subject: Re: [EE] CNC+solder paste prototyping > > > > On Tue, 10 Jun 2008 08:23:13 -0700 > > "Vasile Surducan" wrote: > > > > > A board detail, picture attached, hopefully will not be rejected again. > > > > Hi Vasile, > > > > I don't think you want to do thermal relief on the grounding pads of the > > RF connector - or at least foresee many more grounding connections than > > just the ones in the corners, to avoid extra inductance in the ground > > connection. > > > > Also, I suppose you are using double-clad board. You will probably need > > through connections to assure both sides are at the same level, > > particularly near the connector, and the strip leading to it. > > > > Both are easy to do post-mill if you don't want to mill again. Just short across the gap with solder and add a few via holes around the area to be filled with a bit of wire and soldered on both sides. Sure, thx. Vasile -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist