Hi - I've done a bunch, hand soldered with wire solder, no problems.
I suggest using a flux pen like Kester #186.  I soldered them the same
way as tqfp: use flux pen on pcb pads, tack the chip down on corners,
put more flux down, then solder "pins" by just sweeping solder across
them.  Fix any bridges with solder braid.

They actually go faster than tqfp, since the solder "sweep" is really
quick once you get the hang of it.

Also - sometimes the QFN bottom pad must be connected to ground,
sometimes optional, but it is there for mechanical strength.  I put a
50mil via in the pad so I can solder it down from the backside with fine
tip soldering iron.

Good luck!
J


Stephen R Phillips wrote:
> Anyone have experience with designing with said packaging for
> devices?
> 
> Apart from the finer pitch and .. no leads (heh) what is the biggest
> issues that might come up with routing?  My biggest concern is
> routing area, it appears that these will use less routing area than
> QFP packaging with the same main package and shorter leads.
> 
> Can these be hand assembled? TI seems to think so, hence the
> question.
> 
> I thought there was an [ARM] discussion on the PIC list but I've
> either not received any messages or there isn't. (random thought)
> 
> Erstwhile I said PIC and this is EE related so it's mostly on topic
> right?
> 
> Stephen
> 
> 
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