IEEE approved in depth electronic packaging course utterly 
superb PCBs
and much much more

        http://www.prc.gatech.edu/academics/elpkg/

Section 3 is on PCBs - around 100 pages on this alone

        http://www.prc.gatech.edu/academics/elpkg/pdf/module3.pdf

Section 6 - 30 or so pages on SMD

        http://www.prc.gatech.edu/academics/elpkg/pdf/module6.pdf


        Russell



Source PRC at Georgia Tech and other centres - PRC director 
Prof Tummala seems to get around

    http://www.raotummala.com/

The Microsystems Packaging Research Center (PRC) is housed 
in the Manufacturing Research Center building on the Georgia 
Tech campus. Established in 1994 as a U.S. National Science 
Foundation Engineering Research Center, the Georgia 
Institute of Technology Microsystems Packaging Research 
Center (PRC) is the largest center worldwide dedicated to 
System-on-Package (SOP) and microsystems packaging 
technologies. It comprises 7 academic departments, over 500 
students, 20 faculty, 15 researchers, and 50 companies from 
around the world. The PRC offers unique and 
interdisciplinary degree programs at the B.S., M.S., and 
Ph.D. levels as well as continuing education in SOP 
technologies. It also leads several conferences and 
workshops in packaging research and education.



__________

Also available in a "real book look" form as a Google book
for $ here (many but not all pages available free online)

        http://books.google.co.nz/books?id=P93ZrOWHlO0C&pg=PA82&lpg=PA82&dq=%22Electronic+products+are+now+integral+parts%22&source=web&ots=rjiJeS74xO&sig=WlxmLfgooBD7dh3Wka0jojPD_L8&hl=en#PPA2,M1




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