msi1259 wrote:
> I've searched the archives on doing ICSP using pogo pins, and am now 
> unclearer on exactly how it is done. Are through-holes used to land the 
> pins on the preferred method?   Is a pc board made up to match the holes 
> (or chip pins) to hold the pogo pins? What holds the assembly down 
> during programming?  Are adapters (i.e. ICSP to pogo pin for SOIC / thin 
> DIP chips) available somewhere? TIA!
>   
We are using this technique without a problem.

Our pogo pins are on 0.100" ctrs. We have created a pogo pin "holder" by 
mounting the  pogo pin
receptacles on a 0.100" ctr 5-pin connector.  We then grab the  
connector  like it was a  pencil., and
probe onto the PCB.

The "target" on the PCB is a pad of 75mils with a 28mil hole. These pads 
have a HASL finish, but
a gold finish would work just as well.

We use a wedge-shaped probe head, usually called a "chisel".  When the 
pogo array is "probed " into
the  5 holes,  a reasonably good connection is made when the chisel 
point  enters each hole., with the chisel
forming several high-pressure contacts around the edge of the hole.

Another way of doing this  is to use sharp "needle point" probes against 
a flat pad (no hole). That works
fine for a short while until the needle point wears down. After that you 
will obtain a poor connection, and it will
be intermittent.


This works very well, and it is not expensive.

--Bob
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