At 02:21 PM 1/9/2008, you wrote: >My guess is the thickness ratios of the metals have to be exact so the >expansion rates together match that of glass. Easier said than done! Perhaps so. Looks like more than 25% of the wire is the Cu cladding. I think I'd like to minimize the number of variables if I was fiddling with something like that. ;-) >Best regards, Spehro Pefhany --"it's the network..." "The Journey is the reward" speff@interlog.com Info for manufacturers: http://www.trexon.com Embedded software/hardware/analog Info for designers: http://www.speff.com -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist