Vasile Surducan wrote:

>If DIPs are mounted in through plated holes then hot air removal is the best, heating on component side and not on solder side. The pins must be stright for this methode works.
>
Do you have a recommendation for "tip" type/size for this?   I've tried 
this before but from the bottom, not from the top and only really 
succeeded in scorching the pcb.

I'm assuming you use a pick or similar under the component to pry?

Does board preheating help as well?  (asking the SMD rework questions).

-forrest
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