On 4/23/07, Richard Prosser wrote: > Forrest, > You could try running a "blob" of solder down both sides of pins. If > you get enough solder in place then the thermal inertia is enough to > keep it molten while you pull the part (using something that will grip > it at the ends).. But you do need a bit of space each side and the > part is likely to be damaged and you can have a bit of a clean-up job > to do afterwards. > This method works well. To keep from damaging the board, try this variant: Grip the part with a needle nose pliers (add rubber bands on the handles so you can let go). Flip the board over. Now attack the pins with a row of solder on each side and brisk movement of the iron. When all the solder melts at once, the chip drops out with the weight of the pliers. Clean holes by heating them up, then applying a puff of compressed air via lungs and a small straw. No need to clean the holes to spotless perfection, just clear them and insert the new part. Add flux, reflow, done. Regards, Mark markrages@gmail -- Mark Rages, Engineer Midwest Telecine LLC markrages@midwesttelecine.com -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist