If DIPs are mounted in through plated holes then hot air removal is the best,
heating on component side and not on solder side. The pins must be
stright for this methode works.

Vasile


On 4/23/07, Forrest W Christian <forrestc@imach.com> wrote:
> I have a need to be able to rapidly desolder some DIP IC's for
> replacement.  I've tried various methods and haven't happened onto a
> method that actually works quickly.   I've tried solder wick, solder
> suckers, desolder (vaccuum) irons, hot air bath, etc.  The best way I've
> found so far is to snip off the bad IC and then clean up all the holes -
> but that isn't all that fun since my clearance around the DIP isn't all
> that large for snipping and cleanup of holes with a small dip lead left
> in them isn't all that easy.
>
> I seem to recall back in the '80's when boards covered with DIP packages
> were common a special iron to heat all of the pins of the package
> simultaneously.   My google skills have failed me in finding one. My
> thought is that this would liquify the solder around the dip and allow
> me to yank it off of the board intact which would make cleanup for
> replacement easier.
>
> Mainly this is for rework/RMA.  This particular IC is external-interface
> facing and tends to get blown out under some conditions.   I've started
> socketing it, but really would prefer not to do so if I can figure out
> how to rework this IC without it being such a pain - since this IC needs
> some heat condition to the board, and the socket doesn't really help
> conduction all that much.
>
> Ideas or a source for the DIP package desoldering iron?
>
> -forrest
>
>
> --
> http://www.piclist.com PIC/SX FAQ & list archive
> View/change your membership options at
> http://mailman.mit.edu/mailman/listinfo/piclist
>
-- 
http://www.piclist.com PIC/SX FAQ & list archive
View/change your membership options at
http://mailman.mit.edu/mailman/listinfo/piclist