Hi all,

I'm trying to learn about panelizing -- general how-to's, rules, tips, etc.  I 
am not looking for a tutorial on how to use Eagle to duplicate the boards, 
etc, but really *what* I should do when panelizing.

Currently I am re-laying-out a panel of small boards (which was panelized by a 
CEM originally), but I want to do this in advance now and then send it out 
for quoting to different board houses.  I'm looking for info on if/how any of 
these are possible, and anything else I should know...
- I want to add 2 pads to each *panel* (not each individual board) for power 
connections so that I can test the whole board at once.  The firmware on each 
board is already setup to run a self-test on initial power-up.
- Are there general guidelines for how wide the breakaway points should be, 
and how far I should space the holes so that they're well supported during 
assembly, but breakaway easily?
- Also, I want to move the breakaway holes so that the "burrs" left over on 
each individual PCB after separating them do not extend outside the perimeter 
of the individual PCB's.
- I also know I'll need fiducials, but is 2 enough?
- Etc, etc, etc.

Links, pointers, info appreciated.

Cheers,
-Neil.
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