Alan,

On Wed, 31 Jan 2007 08:51:37 -0000, Alan B. Pearce wrote:

>...
> Another trick used on large boards was additional power distribution strips 
> consisting of two layers of metal separated by a thin insulation layer. 
> These allowed a higher current carrying capacity than the PCB tracks, and 
> had the added advantage of being a long distributed bypass capacitor. This 
> was in addition to the capacitor per chip.

I think I've still got some of those somewhere - they're flat, horizontal strips designed to fit underneath 0.3" chips (or sockets) with pins going out to 
the power and 0V pins.  They're probably as good as you can get in decoupling, since they're effectively zero distance from the chips' supply pins, 
and you can use them on homemade boards (or even veroboard)  but I haven't seen them for a while, so presumably the demise of TTL as the 
dominant technology means they're not necessary.

Cheers,


Howard Winter
St.Albans, England


-- 
http://www.piclist.com PIC/SX FAQ & list archive
View/change your membership options at
http://mailman.mit.edu/mailman/listinfo/piclist