peter green wrote:
>> Can I infer that components that ship sealed with dessicant and sensor =

>> dots inside the bag are poor candidates for a "casual" heating profile?
>> D
> not sure, i think the problem with those is that they can break if they g=
et damp and then are heated to soldering temperatures, i belive you can get=
 arround this by backing tham at arround 120=B0C for 24H (at least that is =
what the peice of paper that came with an AD sample that was a moisture sen=
sitive package and not shipped in gas tight packaging said)
> =

> =


Peter is correct; parts that have been subject to "high" levels of =

humidity should be baked as per the instructions often seen on the chip =

packaging.

But if you get a new bag of chips properly sealed, there is no =

particular problem with doing the 'easy bake' routine with them.

-- =

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