> Can I infer that components that ship sealed with dessicant and sensor =

> dots inside the bag are poor candidates for a "casual" heating profile?
> D
not sure, i think the problem with those is that they can break if they get=
 damp and then are heated to soldering temperatures, i belive you can get a=
rround this by backing tham at arround 120=B0C for 24H (at least that is wh=
at the peice of paper that came with an AD sample that was a moisture sensi=
tive package and not shipped in gas tight packaging said)


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