Hi Vasile, Why don't look to a combined device FLASH and SDRAM or DDRAM in same small case? Mobile devices. In case the address and data buses is common to both chips. Cheers Miki ----- Original Message ----- From: "Vasile Surducan" To: "Microcontroller discussion list - Public." Sent: Friday, November 24, 2006 11:11 AM Subject: Re: [EE] the thinnest SDRAM BGA package > On 11/23/06, Jinx wrote: >> >1mm to 1.4mm which is too much for my application >> >> Is it possible you could use an xQFx package rather than BGA >> and route into the board, inserting the RAM below the surface ? > > Do you mean like using a TSSOP and cutting the package shape on the PCB ? > Would be nice but TSSOP is already *very* big. > > I have no room left on the "component side" so I need to route the > FLASH on the solder side where 0.8mm to max 1mm is the space left. > >> If you could do that, put it in dead-bug style, leaving just the >> thickness of the pins above > >> >> >> -- >> http://www.piclist.com PIC/SX FAQ & list archive >> View/change your membership options at >> http://mailman.mit.edu/mailman/listinfo/piclist >> > -- > http://www.piclist.com PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist