On 11/23/06, Jinx <joecolquitt@clear.net.nz> wrote:
> >1mm to 1.4mm which is too much for my application
>
> Is it possible you could use an xQFx package rather than BGA
> and route into the board, inserting the RAM below the surface ?

Do you mean like using a TSSOP and cutting the package shape on the PCB ?
Would be nice but TSSOP is already *very* big.

I have no room left on the "component side" so I need to route the
FLASH on the solder side where 0.8mm to max 1mm is the space left.

> If you could do that, put it in dead-bug style, leaving just the
> thickness of the pins above

>
>
> --
> http://www.piclist.com PIC/SX FAQ & list archive
> View/change your membership options at
> http://mailman.mit.edu/mailman/listinfo/piclist
>
-- 
http://www.piclist.com PIC/SX FAQ & list archive
View/change your membership options at
http://mailman.mit.edu/mailman/listinfo/piclist