Yeah, that's actually how I do it. But sometimes you have to rework a part, hence the pad tinning. It's just too much time and work to reflow a board for one part when it's double sided. :-) On 11/22/06, Vitaliy wrote: > > Shawn Wilton wrote: > > I've had no problem doing 0603 components reliably. It gets difficult > > when > > you try QFN parts. Those require a stencil and must be reflowed, or put > > the > > heat gun to them. Something I've found that works for me is pre-tinning > > the > > pads on the board so you can apply the part, put heat to the pin and it > > should wick the solder up the pin giving you a satisfactory joint. > > Have you tried baking your PCBs, instead of hand-soldering? We use a > regular > $20 toaster oven at work, and it works perfectly for prototypes and single > boards. Sure beats soldering SSOPs by hand. :) > > Best regards, > > Vitaliy > > -- > http://www.piclist.com PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > -- Shawn Wilton (b9 Systems) http://b9Systems.com <- New web page -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist