From: "Jinx" Sent: Wednesday, November 15, 2006 11:33 PM > The 10F is a little trickier though. For the prototype I'd suggest > breaking connections to the rest of the circuit with a switch, as > outlined in the page above. By using small pads this needn't take > up too much room on a PCB. Alternatively you could mount one > in an 8-pin socket and treat it as the DIP version. If this were > to be a production run, maybe try this ; have pads for ICSP > and use pogo pins. The pads would be split, ie two semicircles > close together isolating the PIC from the circuit. After programming, > by pressing the pogo pins on the PIC-side contacts, simply put a > blob of solder down to bridge the two semicircles. At some later > time you could wick the solder off to re-program I like the split pad idea, though I don't think I'll be able to make a pogo pin jig. More likely I'd solder temporary wires to the pads and use micro-clips My PS+ is still running the old eprom firmware. I was about to buy the flash upgrade module (as soon as I decide if I want 5 16F628A's or 25 for the price break from Mouser). Would I be better putting the money towards another programmer instead of upgrading the PS+? -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist