On 9/3/06, Ian Lesnet wrote: > I have no problem knocking up prototypes for TQFP or even QFN w/0402 > using an inkjet & overhead transparencies. I love the SSOP & TQFP > packages. I can solder a while side of a TQFP with one stroke of my > 10Euro firestarter. Drilling and soldering a dip40 is a real pain, and a > big chance for disaster with a misaligned hole. What I really have a > problem with are QFN with a center ground pad, but even this can be > prototyped on a griddle with a little solder paste. > Wow, inkjet & overhead transparencies ? That is really impressive. The QFNs with a center ground pad are really hard to solder even with hot air rework station... -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist