Note "... almost impossible to exaggerate."

Henry Spencer, only slightly outside his several specialist areas 
says -

To: "Arocket List" <arocket@exrocketry.net>


> On Sun, 10 Sep 2006, Sture wrote:
>> I think the problem is exaggerated. No one is going to use pure tin 
>> for
>> solder anyway.
>
> As David indicated, the big issue is with places where solder used 
> to be
> used for *plating*, not for joining -- as a protective coating on
> component leads and PC boards.  Pure tin *is* being used as a 
> substitute
> there, and it definitely has whisker problems.  The severity of the
> problem for high-rel applications like avionics is almost impossible 
> to
> exaggerate.  (Most of the high-rel stuff is nominally exempt from 
> the
> lead-free rules... but is that a big enough market to keep the 
> component
> suppliers shipping solder-plated parts?)
>
>                                                           Henry 
> Spencer
> 
> henry@zoo.utoronto.ca
> 
> (henry@spsystems.net)

-- 
http://www.piclist.com PIC/SX FAQ & list archive
View/change your membership options at
http://mailman.mit.edu/mailman/listinfo/piclist