On 2/4/06, Marcel Birthelmer <marcelb.lists@gmail.com> wrote:
> >
> > Use a large numbers of vias between ground planes with the same name on
> > different layers.
> >
>
> Isn't that a problem as far as ground loops are concerned?

No Marcel, this is a fairly common procedure on RF boards.
Every via it's an inductance. The ideea is to minimise the inductance
value between ground planes and have a massive unique ground.
There are a huge numbers of article about this, I suggest Maxim site,
application note about RF transcievers, supply filtering on high
frequency/high slew rate operational amplifiers.

best regards,
Vasile



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