On 1/27/06, Shawn Wilton wrote: > Does anyone have a list of potential dos and do nots for PCB layouts There is not a distinctive rule. Any different project may have different rules. In a mixed digital, RF and analogic design you may have one of more digital grounds, RF grounds, analogic grounds. For RF grounds the rule is keep them continuous as much as possible and use golden plate + thousens of vias (except microstrip on low epsilon PCB where there is no room for vias). For analogic grounds the rule is connect them to supply in the minimum impedance point (created by low esr capacitors) and care about supplying comparators versus low signal OA. For digital ground, any rule you'll use could be insufficient. However do not use VCC power planes on analogic or RF design, use them only on digital designs. Do not mix analogic with digital ground even they are on different layers. Use enough isolation between any kind of grounds. Use a large numbers of vias between ground planes with the same name on different layers. Finally: when you'll desing at least 1 square meter of PCB projects you'll know better than us what to do. cheers, Vasile > involving power planes and ground planes? I've done some googling and > haven't found anything really relevant to potential things you may not want > to do. > > For example, is it considered OK to place a power fill plane on the same > layer as some of your digital I/O? (None of this is high speed). > > I'm hoping maybe someone has a list of things I should watch out for. > > I know there are some guys on here with *years* of layout experience, so I > figure I would poke the grey matter a bit before sending off this board. > > -- > > > Shawn Wilton (b9 Systems) > http://black9.com > -- > http://www.piclist.com PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist