In message <012701c6158c$74f536f0$0100a8c0@ivp2000>
          Jinx <joecolquitt@clear.net.nz> wrote:

> For ICs, tin one corner pad, align/solder/cool as above, then do
> the opposite corner

I've done TSSOPs like this:
  1) Place the part roughly in position and put some "Blue-tak" on the sides
of the IC casing (not where the pins are!) to hold it in place.
  2) Gently tweak the alignment of the chip until it's aligned *perfectly*.
  3) Solder two diagonally opposite pins down. Check the alignment again,
reheat and tweak if necessary.
  4) Soak the pins and the board in flux.
  5) Put a blob of solder on the tip of the iron
  6) Run the soldering iron over the pins. Watch as 20 pins get soldered down
in three seconds.
  7) Get a magnifying glass out and look for short circuits. Remove them with
desolder wick - don't worry too much about resoldering pins. Those tiny pins
tend to make it difficult to completely remove all the solder - generally
speaking, enough is left over to keep the pins stuck down.
  8) Now poke the pins with a multimeter probe or similar sharp object.
Reheat any that move.
  9) (optional) Put some isopropyl on the board and scrub the flux off with
an old toothbrush.

  This is how I've been doing it for the best part of a year - I've soldered
a good half dozen TSSOPs and a few SSOPs this way, and have (thus far) only
killed one IC. 

  I still solder SOICs like DIPs - solder two diagonally opposite pins to
hold it down, then solder the rest of the pins individually.

  Also, never underestimate the usefullness of Blue-tak. It's great for
holding down SMD chips while soldering them. IIRC I picked up the trick from
a site that sold the STV5730A video chips...

  Anyone feel like sharing their soldering tips, or do y'all consider them
trade secrets? :)

Thanks.
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