I need to design a TQFN-56 package with exposed (thermal) pad and a
number of through holes on this exposed pad between layers 1 and 16.
Drawing the TQFN is ok. Drawing the through metalised holes is ok
using vias. But in the library can't coexist vias on rectangles or
polygons without generating error in DRC when component is used.
The exposed pad needs a large numbers of holes and open copper
surfaces without termals (while the other power planes on layers 1, 2,
3 and 16 needs thermals).
So, how can be done in library without using restrict tricks and
multiple planes in the board ?

greetings,
Vasile

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