> http://www.winbond.com.tw/c-winbondhtm/partner/PDFresult.asp?Pname=1021 > > My kid has a toy car carrier that's outfitted with MFID (Magnetic Field > ID) to ID the cars on the truck. > > The transponder chip is available in a wafer or die package. > What's the difference? > I'm gonna guess that the die package is the individual chip cut from the large wafer. The wafer is the uncut wafer (you get to cut it yourself!). Harold -- FCC Rules Updated Daily at http://www.hallikainen.com -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist