Oops - should be wafer vs. dice package -----Original Message----- From: Charles Craft Sent: Dec 13, 2005 10:57 AM To: piclist@mit.edu Subject: [EE]: Wafer vs. die IC package http://www.winbond.com.tw/c-winbondhtm/partner/PDFresult.asp?Pname=1021 My kid has a toy car carrier that's outfitted with MFID (Magnetic Field ID) to ID the cars on the truck. The transponder chip is available in a wafer or die package. What's the difference? -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist