In SX Microcontrollers, SX/B Compiler and SX-Key Tool, gresethr wrote:

Being in the semiconductor industry for +20 years and now as a foundry, package styles come and go.  Change happens, and packaging houses change their package types to support the major portion of the industry.  In this case, sounds like the die is alittle to big for the lead frame of the 52tqfp.  As for the soldering of them, I have successfully soldered hundreds by hand.

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