I have recently tried "de-poting" a burned motorola RFID reader. It was a
succesfull job. Its very easy. Just a hot air gun and a screwdriver. Heat it
up and then remove piece by piece of the resin.

Then, I tried to do it in a working device and I have a non-poted working
RFID reader, just for the fun of it... :) 


Mauricio Jancic
Janso Desarrollos - Microchip Consultants Program Member
info@janso.com.ar
www.janso.com.ar
(54) 11 - 4542 - 3519

-----Original Message-----
From: piclist-bounces@mit.edu [mailto:piclist-bounces@mit.edu] On Behalf Of
Jesse Lackey
Sent: Wednesday, September 21, 2005 10:44 PM
To: piclist@mit.edu
Subject: [EE]: Potting compound to protect IP?

Hello all,

I've just finished a product that uses a specialized dc/dc controller
(designed for a wholly unrelated field) with some further tweaks to solve a
particular thorny problem.

It took three major redesigns to get here, 100s of hours, etc.

But... it could be easily copied.  And can't be patented.

So... at the very least I'm going to (carefully) sand off the markings on
the IC.

But it would be great to seal everything up as well.  Only the dc/dc section
need be protected, there is no need to encapsulate everything.
Ideally just a tablespoon of viscous goo poured over it.

Now I realize there are limits to what can be protected, the goal is to make
it hard enough that casual poking around won't yield any clues.
The product is a specialized enough thing that there aren't many companies
in the business field that would be interested in it, so it doesn't need to
withstand some concerted, well-equipped "attack".

Has anyone been in this situation before?

Any advice appreciated!
Thanks
Jesse


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