Some good surface mount resources

Philips databook SC18 has a comprehensive list of Philips SMT packages 
and recommended reflow and wave pad footprints.
A real book is easier to use.
If you don't have one then the 291 page pdf is here
Far more practical for most purposes than eg JEDEC site.

        http://www.hta-bi.bfh.ch/E/ecad/PCB-Data/Documentation/Philips-SC18.pdf

13 page excerpt of SC18, chapter 4 covering soldering guidelines and 
SMT footprint design.

        http://www.semiconductors.philips.com/acrobat_download/various/SC18_CHAPTER_4_1.pdf

SC18 Chapter 5
Thermal considerations and design.

        http://www.semiconductors.philips.com/acrobat_download/various/SC18_CHAPTER_5_1.pdf

Philips packages.
You can rapidly search by code or wade through an extended selection 
tree

        http://www-us.semiconductors.philips.com/package/

Example of what you can get to by wading the above.
recommended pad dimensions for wave and reflow soldering the (all the 
same) SOT89 / SC62 / MPT3 / UPAK / TO243

        http://www.semiconductors.philips.com/acrobat_download/packages/footprint/SOT89-(SC-62)-REFLOW-WAVE.pdf

LT packages, markings
Not as useful as SC18 but complements it.

        http://www.hta-bi.bfh.ch/E/ecad/PCB-Data/Documentation/Packages.pdf


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