> Place your ground and power planes as the outside layers if you can. Use > the inner layers as the signal layers. Funny, I tried that one time and was amazed at how much surface area I lost from having to use an overabundance of vias and traces that have to exist on both the component layer and on an inner layer. So much so that I had to abort & go back to the traditional layer stack. Seemed like a worthwhile concept but simply was not feasible in my case. I'd try it again on a thru-hole only or low-density board though. But then that would call for a single or double sided board and it would be a "no, nevermind." Thanks for the hlep, Dwayne. Rick -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist