On 17 Jan 2005 at 13:26, Lawrence Lile wrote: > Once upon a time, I had a nice DOC on using copper clad boards as heat > sinks. Alas, I can't locate it anymore. Infineon have a paper called "Thermal Resistance Theory and Practice" that covers it quite well. There is also an online calculator at http://www.frigprim.com/online/therm_terr.html that may help. Steve. ========================================== Steve Baldwin Electronic Product Design TLA Microsystems Ltd Microcontroller Specialists PO Box 15-680, New Lynn http://www.tla.co.nz Auckland, New Zealand ph +64 9 820-2221 email: steve@tla.co.nz fax +64 9 820-1929 ========================================= -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist