The Numbnuts guide to soldering smd is Out-standing Jan-Erik ----------------------------------------------------------------------- ----------------------------------------------------------------- DXTron Technology Inc PCB Assembly PIC Chip Programming ----------------------------------------------------------------- redrock8@dxtron.com ----------------------------------------------------------------- ----- Original Message ----- From: "Jan-Erik Soderholm" To: Sent: Thursday, October 07, 2004 12:44 PM Subject: RE: [PIC]MAX3001E was Voltage pull-ups for 1.5v signals? > Peter Johansson wrote : > >> Jan-Erik Soderholm writes: >> >> > Now, this is nothing new, and there are adapters available to >> > "convert" TSSOP (and other SMD) packages into a "DIP" footprint. >> > A quick search on Google for '"TSSOP to DIP" converter' >> > gave these links : >> > >> > >> > http://www.accutekmicro.com/product_detail.cfm?Product=DIP%20Adapters >> > http://www.epboard.com/eproducts/protoadapter.htm >> > http://www.logicalsys.com/painfo-vpasp-vb.asp?adapter=pa-ssd3sm18-20 >> >> It's difficult to tell from the pictures, and I was unable to discern >> details on the associated pages, but it still looks like this is just >> a bare, solderable header, and you still need to be able to solder the >> chip to the header. > > Think "solderless breadboard". > >> I think I might be able to hand-solder a SOIC >> package, but as yet I cannot imagine hand soldering any finer-pitch >> devices than that. > > There are workable methods for one-offs. > Here is one : > > http://warmcat.com/milksop/soldering.html > > Regards, > Jan-Erik. > > _______________________________________________ > http://www.piclist.com > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist _______________________________________________ http://www.piclist.com View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist