For those interested or affected, and for those who scoff at the real=
ity of
the transition to lead free solder and lead free products, here is Li=
near
Technology's position on & and progress towards lead free componentry=
. LT,
while not as large as some, are not a minor player in the electronics=
 field.

        http://www.linear.com/about/pbfree.html

Dated Jan 2004 and currently on their web site.

_____________________________

Note:

"In order to comply with the EC deadline of July 2006, we plan to con=
vert to
Matte-Tin as our standard terminal finish by the end of 2005. As Line=
ar
Technology Corporation converts a package type to Lead-Free, as our s=
tandard
plating finish; we will provide notification (PCN) to our direct cust=
omers
and Distributors prior to 100% conversion to this lead-free alternati=
ve. "

And

Current lead-free solder paste alternatives, which have a 25=B0C to 5=
0=B0C
higher melting temperature than tin-lead solder, push the performance=
 limit
of the systems used in printed circuit board assembly. In addition, t=
he
260=B0C peak re-flow temperature used on lead-free alternatives will =
adversely
impact the moisture performance of our packages. To date, moisture
sensitivity testing conducted at a peak re-flow temperature of 260=
=B0C has
confirmed this drop in moisture performance, but results to date indi=
cate
that our matte-tin plate packages are still reliable after exposure t=
o these
more stringent re-flow conditions.

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