Not from any scientific data, but rather random thoughts...

I would think that soldering thru-hole parts on both sides (this will hap=
pen=20
with plated-thru holes), should be mechanically stronger.  But then, the =
SMT=20
parts should be more difficult to rip off the board, due to less weight.

It may be easier to prevent flexing on a smaller board (SMT parts).=20

But if you're that worried, how about sealing the unit in epoxy, potting=20
compound, etc?

And how about damping it from vibrations with some type of rubber mounts?

Cheers,
-Neil.


On Monday 19 April 2004 07:45 pm, Robert Ussery scribbled:
> Hi, Folks.
>
> Generally speaking, which circuit construction method is more durable,
> through-hole or surface mount? I'm getting ready to build a device that
> will need to survive significant physical shocks and accelerations. I'd
> prefer surface mount construction for the size advantage, but I'm conce=
rned
> that flexing of the board and other physical stresses may cause surface
> mount parts to separate from the board.
>
> Your thoughts?
>
>
>
> - Robert

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