> I was thinking that these chips just might be the *exact same die*,
> just a different number of the pins bonded out. It kind of makes sense
> and lots of other chip makers do this. They could actually be
> the exact
> same chip, just a different package and part number.

Could be, but the sudden introduction of this alarms me. Why not use the
same 'silicon sharing' for 16F877/16F876 etc?

Wouter van Ooijen

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