On Mon, Dec 22, 2003 at 06:46:49PM -0500, Spehro Pefhany wrote: > The mass produced "hockey puck" style modules of which we are speaking > are really only half a product. The heat sink must be supplied externally. > They are supposed to be designed into OEM applications. Ah, right. Correction noted. -- James Cameron mailto:quozl@us.netrek.org http://quozl.netrek.org/ -- http://www.piclist.com hint: PICList Posts must start with ONE topic: [PIC]:,[SX]:,[AVR]: ->uP ONLY! [EE]:,[OT]: ->Other [BUY]:,[AD]: ->Ads