It looks like both the ADXRS150 and ADXRS300 are only using the outer pins.

> A drop of cyanoacrylate and short wires to the outer pads works just
> fine to bond them to the board. You actually get better bonding since
> you have more chip area glued than pad area soldered. You get to the
> inner pads with wirewrap wire, and then coat the 'loose' wires with
> hot melt glue (so it's easy to remove with a hot air gun).
> > That certainly is possible, however if the part has alot of pins
> > that could get quite ugly. Obviously I would also not be a very
> > "strong" type of connection, so I wouldn't recommend it in any
> > application that has the possibility of vibration. TTYL
>
> You could also look at putting vias where the BGA pads would be.
> Then you could wick solder up larger than normal via holes to get
> contact. Flux on the bga pads is ESSENTIAL for this trick to work.

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