In production the whole package is heated up such that the solder (paste or
desposit left from flow) melt when the balls get hot.

Consult the data sheet and you should find a max temp and time allowed for
this process.
--
Veronica Merryfield, somewhere in Cambridgeshire, UK
"Constructive laziness is the root of all good engineering"
"The best things in life aren't things"
Do not wish to be anything but what you are, and try to be that perfectly. -
St. Francis De Sales
www.dunrunnin.co.uk www.greyhoundgap.com
www.yadvashem.org.il - Everyone should visit



----- Original Message -----
From: "harshit suri" <suri_list@YAHOO.COM>
To: <PICLIST@MITVMA.MIT.EDU>
Sent: Thursday, November 13, 2003 12:09 AM
Subject: [OT]: How to solder BGA


> I am planning to get a mems gyro from ADevices.
> Can someone pls explain how to solder the ball pins
> that are underneahth the package. the ones on the
> periphery seem to be easy to solder. what abt the one
> underneath and inaccessible.
>
>
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