Jai,
perhaps what you should say is that you want "through hole" parts vs "smt".
 DIP means Dual Inline Package - two rows of pins parallel.

I won't say none are available but the emphasis for the last several years
is smaller parts that are easier for automatic assembly processes which
means smt.

Finally, don't be put off by smt.  It's far easier than it looks,
especially if you only have a few to do.  You could put an smt IR module
onto a board full of through hole parts and it would likely be easy.  Look
for parts with fewer leads with the greatest  pin to pin spacing and at
first, avoid parts with lots of leads closely spaced.  After you get good
at it (you will), then you can try 408 lead ball grid array parts. ;)

Good luck!
Tom M.

At 10:37 AM 6/7/03 -0400, you wrote:
>I want DIP for two reasons basically... one, it seems to be a lot easier to
>prototype with. Second, I haven't worked with SMT before. Sure, I could
learn,
>but time is kind of important in this application. I wouldn't want to have to
>make a little board just so I could play with this IC, but maybe I will have
>to.
>
>Anyway, looking around on Vishay, Infineon and Agilent, it doesn't seem like
>I'm going to get any DIP packages, so SMT it is. This will be an interesting
>experiment :-)

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