> I don't want to use bottom layer because
> mirroring also inverts names and labels  and that does
> look ugly. I know what thru-hole means, but on some
> thru-hole parts, like DB9 and RJ45 connectors, one
> does not have acces to pads from both sides.

Let me see if I understand.  You have mostly SMD parts, so you want to
put them on the top layer where they go by default, and without
inverting labels/etc.  This means that all of your tracks and pads so
far are also on the top layer.  You want a single-sided board, so if you
need to add a through-hole component, it should be on the bottom if you
want to solder on the top.

The "mirror" command on your TH parts should do this just fine...

It also works fine to put the occasional SMD on the bottom of an otherwise
TH-only single-sided board.  Which parts you "mirror" just depends on which
ones are the "exceptions."

BillW

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