My recollection is that it was the other way around- Intel introduced
    the first EPROMs as OTP devices (better than mask-programmed) and the
    quartz- window packages came bit later. IIRC, the 1702 was the first
    EPROM, the earlier 1601 was OTP.

Hmm.  That could be.  Perhaps the OTP EPROMS dropped out of popularity
when they invented the lidded packaging.  I'm no expert on IC packages;
when did plastic packages become available in general?  I certainly
don't remember OTP EPROMS being available until about the 27c512
timeframe (maybe the non-cmos parts need ceramic packages for heat
dissipation?)  Never saw a OTP 1702 or 2708, for instance.  Or, for that
matter, OTP 8752s from intel?

BillW

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