Peter L. Peres wrote:

>At least one PIC went on a Shuttle mission. Ditto embedded Linux afaik
>(probably on Motorola but I am not sure). They probably choose
>commercially hardware after they drop it off cliff.
>
 From what little I've read there are specifications down to the exact
solders approved.  I imagine there are very few pieces of commercial
hardware that would pass at the board level, nevermind the product
level.  Cosmic rays penetrate everything up there at one point of
another, so the size of the features of the die in a chip and its
packaging are as important as many other considerations.

The stuff that goes up 'on a shuttle mission' has less strict specs than
the stuff that is part of flight control.  An off the shelf embedded
computer, if well made, would still have problems though.  Not only are
they concerned about whether the device will make the trip without
damaging itself or anything else, but 'little' things like outgassing
are of critical importance.  Not only could the chip packages give off a
terrible odor (which we wouldn't notice here, but in confined spaces
with recycled air could lead to nausea) but the chemicals released can
damaged air handlers and other safety critical equipment.

>If it works after that
>they take it up. I'd be wary of a laptop. The screen could shatter or
>something and hen you can't see a thing and the disks will crash hard if
>the cabin pressure is lost.
>
Hard drives meant for high altitude applications are completely sealed
with air inside, as opposed to those we use on the ground which have
filtered air vents.  I'm certian everything with glass or any brittle
material must have some layer of protection (plastic).  I would
speculate that even tempered glass wouldn't be accepted as-is.

There are many student projects that are taken up, and many of them have
described the specifications, processes, and procedures to getting their
item up.  Very interesting stuff...

-Adam

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