> The package dimensions are all in the back of each PIC data sheet.
> Everything you need to define an Eagle package is there.

Yes, of course there are part dimensions shown Olin, but these are not ideal
definitions of good pad & pattern design - there are the starting point. As
an example of why I say this, dimension (F)does not define a best pad
length, nor does (B) define the optimal pad width for manufacturability.

I was hoping for a more qualified response that might reveal some insight
into such things as (hypothetically stated) 'leaning toward the Max
tolerance for pick & place, but the min for solderability'
Or perhaps 'be sure to make the pads longer than 1.5 X the lead contact
length, but exceeding 2mm will allow solder bridging that is hidden beneath
the part body and difficult to troubleshoot..' and the like...

Perhaps I am guilty of asking a question that would tempt some to reply in
aa pharisaic manner - Perhaps I should have asked asked if anyone has
practical experience with TQFP packages that they are willing to share....I
am admittedly trying to get up to speed with SMT since my early training and
career was back in the PTH days....

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