> -----Original Message-----
> From: Amaury Jacquot [SMTP:sxpert@ESITCOM.ORG]
> Sent: Wednesday, December 11, 2002 9:20 AM
> To:   PICLIST@mitvma.mit.edu
> Subject:      Re: [OT]: Homebrew BGA mounting techniques
>
> On Tue, 2002-12-10 at 21:14, Ricky Hussmann wrote:
> > Hello all,
> >
> >     I'm working on my senior design project at my university and we've
> been
> > looking into several wireless transmitter packages. However, most of the
> > chips we've found have been BGA. Our sponsor is a local tech company
> that
> > doesn't have the mounting or testing equipment for BGA mounting.
> Currently
> > we're continuing our design with a third party wireless CF card.
> However,
> > I'm still interested in mounting BGA chips. Has anyone had any luck on
> > mounting these chips without the expensive equipment and X-ray testing
> > facilities?
>
> heh...
> don't want to sound too negative, but it's nearly impossible to solder a
> BGA package properly without the equipment you are talking about above.
> Check with Mark Spencer, from Digium.com that makes telephony cards that
> use BGA-packaged devices. he may be able to help you.
>
We have succesfully removed and re-soldered smallish BGA's (14x14 1mm pitch)
with just a SMD hot air pencil and plenty of flux, but it's always a gamble.
I would imagaine the larger devices would prove virtualy impossible with
this technique.  An X ray machine is handy to test the connections, but
sometimes the difference between a good and a poor connection can be very
difficult to spot.

Mike

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