Alan B. Pearce wrote:
>
> >Probably a better solder paste could reduce the bridges
> >(any recommendations?).
>
> Probably a little less paste, so it tends to pull back better due to surface
> tension and capillary action between the pad and pin. If you look at
> commercial SMD soldering, you will see that there really is very little
> solder on each pin, just enough to produce the nice meniscus between the pin
> and pad. If you have enough to allow the solder to bulge over the pad then
> you have too much.


Also putting the line of paste closer to the
end of the chip pins, (not close to the body)
seems to help too. When they bridge it's mainly
up against the chip body.
-Roman

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