>Probably a better solder paste could reduce the bridges
>(any recommendations?).

Probably a little less paste, so it tends to pull back better due to surface
tension and capillary action between the pad and pin. If you look at
commercial SMD soldering, you will see that there really is very little
solder on each pin, just enough to produce the nice meniscus between the pin
and pad. If you have enough to allow the solder to bulge over the pad then
you have too much.

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